- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 26/38 - Removing material by boring or cutting
Patent holdings for IPC class B23K 26/38
Total number of patents in this class: 3186
10-year publication summary
|
220
|
248
|
216
|
285
|
320
|
289
|
285
|
260
|
263
|
68
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 585 |
154 |
| Disco Corporation | 1745 |
82 |
| Hamamatsu Photonics K.K. | 4161 |
81 |
| Bystronic Laser AG | 256 |
80 |
| Amada Holdings Co., Ltd. | 297 |
71 |
| Corning Incorporated | 9932 |
65 |
| Amada Company, Limited | 492 |
58 |
| TRUMPF Werkzeugmaschinen SE + Co. KG | 148 |
56 |
| Mitsubishi Electric Corporation | 43934 |
55 |
| Samsung Display Co., Ltd. | 30585 |
42 |
| Asahi Glass Company, Limited | 2985 |
38 |
| Electro Scientific Industries, Inc. | 416 |
37 |
| TRUMPF Laser- und Systemtechnik GmbH | 505 |
37 |
| Nippon Electric Glass Co., Ltd. | 2299 |
30 |
| FANUC Corporation | 5803 |
28 |
| IPG Photonics Corporation | 494 |
26 |
| Precitec GmbH & Co. KG | 176 |
26 |
| Mitsubishi Heavy Industries, Ltd. | 8217 |
25 |
| Nitto Denko Corporation | 7879 |
22 |
| Robert Bosch GmbH | 40953 |
20 |
| Other owners | 2153 |